Chip bonding device - メーカー・企業と業務用製品 | イプロスものづくり

[Case 3] Shortest connection implementation solution for SOC + memory module

Overcoming the height difference between semiconductor chips! Innovative COC bonding with copper ball spacers.

We directly bonded memory chips and SOCs (COC) and responded to the advanced requirements of flip chip mounting onto package substrates. By coordinating the networks of four companies and ten processes, we successfully achieved bonding between heterogeneous chips of varying heights. Utilizing 40µm pitch copper pillar bonding and 90µm copper balls as spacers, we realized the shortest connections between chips and substrates. This structure, which maximizes signal transmission efficiency, provides a significant advantage in high-speed processing devices. *Details of the network that successfully integrates heterogeneous chips are illustrated in the accompanying materials.*